800L SMT lead free PCB Vitronics BGA Infrared LED Digital display
mini desktop Reflow Soldering Machine
The 800L SMT reflow soldering machine is a main equipment produced
by Shengdian. It can be widely used for SMD soldering and fixing in
SMT workshop for PCB board assembly, LED packaging, LED screen
display, mobile phone motherboard, computer motherboard, safety
control motherboard, electronic products etc. It can realize
precise and stable temperature control in order to achieve fast and
Range of application
Solder paste type: lead-free solder, ordinary solder, SMD glue;
Maximum substrate size which can be processed: 550 (mm) ;
It can be used for the following components: 0805, 0603, 0402,
0201, 01005 small component CSP, BGA, single-sided, dual-sided PCB
The 800L SMT reflow soldering machine can be used to solder the
electronic parts and components such as BGA, various types of IC,
QFN, resistor, capacitor, diode etc. onto LED screen display and
imported high-quality heating components to ensure high stability
and reliability of system.
Instrument control heat automatically, ensure temperature
equilibrium.Optional Computer PID intelligent operation controller.
A special structure of forced hot air circulation system, the upper
and lower heating method, heating up fast, high thermal efficiency.
Temperature tolerance alarm, fault diagnosis function.
reflow soldering machine Imported high-temperature motor, smooth
running, long life, low noise.
|preheating zones||Up 8bottom8||Up 10bottom10||Up 12bottom12|
|Cooling zones||1 dedicated cooling + 1 external cooling||2 dedicated cooling + 1 external cooling||1 dedicated cooling + 1 external cooling|
|Rectifier structure||Electrolytic plate|
|Exhaust volume||10 cubic/min*2 channel|
|Power requirement||Three-phase five-wire 380V (50Hz, 60Hz)|
|Normal no-load power||7KW||9KW||12KW||15KW||18KW|
|Heating time||About 15 minutes|
|Temperature control range||Room temperature -300 ° C|
|Temperature control method||Full computer Win7 system + PID closed loop control + SSR drive|
|Temperature control sugar content||±1.5℃|
|Temperature distribution deviation||±2.5℃|